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FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board

Categories RA Copper Foil
Brand Name: Civen
Model Number: MGP-TR021004
Certification: ISO - ROHS - SGS - CTI
Place of Origin: Shanghai , China
MOQ: 1000kg
Price: USD 5.0 - 48.0 Per Kilogram
Payment Terms: L/C, T/T
Supply Ability: 550000 KG / Month
Delivery Time: 10 - 15 Days
Packaging Details: Wooden Case
Material: Copper
Purity: Cu + Ag ≥ 99.99%
Color: With One Shiny Side & One Gray Treated Side
Application: Adhesive Tape . Flexible Printed Circuit Board
Surface Consistency: Good
Width: ≤ 600 mm ( About 24 inch )
Temper: Annealed And Treated
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    • Product Details
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    FPC Front - End Material High Precision RA Copper Foil for Printed Circuit Board


    Treatment Rolling Copper Foil Used In FCCL Has High Elongation


    Applications:


    (1) Flexible Copper Clad Laminate(FCCL)

    (2) Fine Circuit FPC

    (3) LED coated crystal thin film.

    (4) Adhesion Tape

    (5) Anti - Peel devices and so on


    Normal Specification:


    (1) Thickness: 0.012mm / 0.018mm / 0.035mm

    (2) Width: 260mm / 520mm and so on .


    Performances:


    (1) High flexibility and extensibility

    (2) Even and smooth surface

    (3) Good fatigue resistance

    (4) Strong antioxidant properties

    (5) Good mechanical properties

    (6) The material has higher extensibility

    (7) It has a high bending resistance

    (8) It has no crack.


    Table 1 :


    Name

    GB

    ALLOY NO.

    SIZE (mm)

    (ISO)

    (ASMT)

    (JIS)

    (BIS)

    (DIN)

    Copper Foil

    T2

    Cu-ETP

    C11000

    C1100

    C101

    R-Cu57

    Thickness: 0.006-0.1 /Max Width: 650


    Table 2 :


    Item

    Unit

    Parameters

    12μm

    18μm

    25μm

    35μm

    70μm

    Mass per unit(±5%)

    g/m²

    105

    160

    300

    400

    445

    Cu+Ag

    %

    ≥99.99

    Temper


    H

    O,H

    O,H

    O,H

    O,H

    Surface roughness

    Ra

    μm

    0.13

    0.12

    0.1

    0.08

    0.08

    Rz

    μm

    1.3

    1.0

    0.8

    0.74

    0.76

    Tensile strength

    Normal Temp /23℃

    N/mm²

    ≥430

    ≥450

    ≥450

    ≥450

    ≥450

    High Temp /220℃

    N/mm²

    ≥140

    ≥150

    ≥170

    ≥210

    ≥220

    Elongation

    Normal Temp /23℃

    %

    ≥1.5

    ≥3.0

    ≥4.0

    ≥4.2

    ≥4.5

    High Temp /220℃

    %

    ≥8

    ≥10

    ≥18

    ≥28

    ≥30

    Fatigue Resistance (annealed)

    %

    65

    65

    65

    65

    65

    Maximum resistivity

    Ωmm2/m

    0.0181

    Electrical conductivity

    %

    ≥98.3%

    Film and adhesive layers

    Instant Temp.

    300℃/10s

    Film and adhesive paste after transient

    temperature without blistering delamination.

    Anti oxidation

    H.T.(200℃)

    Minute

    Won’t Change the Color within 60 minutes

    Pinhole test results

    piece/ m²

    Pinhole area more than 0.5 mm²,0.005 piece/ m²


    Note:

    1. Above figures based on the material with 0.05mm in thickness and 600mm in width.

    2. Normally, Copper, cobalt and nickel is coated on the rough surface.

    3. Testing method follows our company standard.


    Table 3 :



    Application and Performance :


    Product Tags:

    pure copper foil

      

    rolled copper foil

      
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